Prof. Madhavan Swaminathan CHIMES Director, Head of the Department of Electrical Engineering from the Pennsylvania State university visited Elohim on Oct. 16, 2023 and discussed collaboration on Heterogeneous Integration of Micor Electronic Systems with Elohim Silicon Capacitors.
Elohim Silicon Capacitor is better suited than conventional MLCC for Power delivery of high performance chips, such as AP for mobile application, CPU/GPU for Data centers and Automotives in terms of high capacitance (1,100 nF/mm2), low impedance (ESR 2 mohm, ESL 0.5 pH), very thin thickness (~60 um), and superior temperature stability (TCC 0.032 %/C) as well.
Center for Heterogeneous Integration of Micro Electronic Systems
The Center for Heterogeneous Integration
of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective
integration and packaging of semiconductor devices, chips, and other components.
This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).